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Interconnection Reliability of HDI Printed Wiring Boards
It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the
development of higher density circuits on build-up printed wiring boards. When
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more
Interconnection Reliability of HDI Printed Wiring Boards
It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the
development of higher density circuits on build-up printed wiring boards. When
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Qualification of ALIVH-G Boards for Handset Assembly
The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding
increased routing densities for printed circuit boards. The handheld wi
.. read more