Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
.. read more
Thermal Cycle Solder Joint Integrity Assessment of SnBi Plated Components
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
.. read more
Thermal Cycle Solder Joint Integrity Assessment of SnBi Plated Components
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more