Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. read more
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. read more
Multilayer Board Thermal Robustness: Proposed New Test Method for Evaluating the Thermal Robustness of Multilayer Boards
Many existing and some new laminate material test methods that are being proven useful for determining a laminate material's suitability for use in higher temperature lead-free assembly process
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. read more
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. read more
Multilayer Board Thermal Robustness: Proposed New Test Method for Evaluating the Thermal Robustness of Multilayer Boards
Many existing and some new laminate material test methods that are being proven useful for determining a laminate material's suitability for use in higher temperature lead-free assembly process
.. read more