Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
Low dk Thermoplastic Substrate for Broadband Antennas
In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c
.. read more
Printable Materials and Devices for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad
.. read more
Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications
In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
Low dk Thermoplastic Substrate for Broadband Antennas
In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c
.. read more
Printable Materials and Devices for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad
.. read more
Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications
In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. read more