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New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly

Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper .. read more

Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications

The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027. .. read more

JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste

1.Obtain suggestions from the solder manufactures Low-Ag SAC Paste •Increase in reflow temp •Impact on thermal fatigue and wetting Sn-Bi low-temp Paste •Impact on shock strength •Creep fatigue .. read more

New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly

Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper .. read more

Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications

The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027. .. read more

JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste

1.Obtain suggestions from the solder manufactures Low-Ag SAC Paste •Increase in reflow temp •Impact on thermal fatigue and wetting Sn-Bi low-temp Paste •Impact on shock strength •Creep fatigue .. read more