Knowledge Hub

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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures

Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo .. read more

Measuring the Impact of Test Methodsfor High-Frequency Circuit Materials

High-frequency materials are characterized by several important parameters, including the dielectric constant or relative permittivity (εr) and the dissipation factor (Df). For those paramet .. read more

Microwave Characteristics and Applications of Liquid Crystal Polymer Flex

We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol .. read more

Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures

Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo .. read more

Measuring the Impact of Test Methodsfor High-Frequency Circuit Materials

High-frequency materials are characterized by several important parameters, including the dielectric constant or relative permittivity (εr) and the dissipation factor (Df). For those paramet .. read more

Microwave Characteristics and Applications of Liquid Crystal Polymer Flex

We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol .. read more