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Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
.. read more
Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields
.. read more