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Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more