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High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...

An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater .. read more

A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations

This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume .. read more

Reflow Defects with Lead-Free Soldering Moisture Sensitive Components

Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav .. read more

High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...

An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater .. read more

A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations

This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume .. read more

Reflow Defects with Lead-Free Soldering Moisture Sensitive Components

Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav .. read more