Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. read more
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. read more