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Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
.. read more
High Phosphorus Electroless Nickel for Selective ENIG (SENIG)
Concerns
There are some areas that must be accepted if planning to run the newest SENIG process:
- Slower plating rate in nickel (to get 150µ“ it will take 20 minutes)
- It works better at hig
.. read more
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
.. read more
High Phosphorus Electroless Nickel for Selective ENIG (SENIG)
Concerns
There are some areas that must be accepted if planning to run the newest SENIG process:
- Slower plating rate in nickel (to get 150µ“ it will take 20 minutes)
- It works better at hig
.. read more