Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges between the Leads of Hand Reworked Fine Pitch...
Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by
passing them together across the flowing surface of a molten solder reservo
.. read more
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. read more
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. read more
Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges between the Leads of Hand Reworked Fine Pitch...
Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by
passing them together across the flowing surface of a molten solder reservo
.. read more
Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings
With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper
.. read more
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. read more