Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. read more
Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobil
.. read more
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. read more
Controlled Surface Etching Process for Fine Line/Space Circuits
The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor
chip design evolves into increasingly finer lines. First,it was studied how fine th
.. read more
Dry Film Resist Stripping from Overplated Lines
The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern
plating,because the plated metal height depends on the current density,which
.. read more
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. read more
Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobil
.. read more
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. read more
Controlled Surface Etching Process for Fine Line/Space Circuits
The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor
chip design evolves into increasingly finer lines. First,it was studied how fine th
.. read more
Dry Film Resist Stripping from Overplated Lines
The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern
plating,because the plated metal height depends on the current density,which
.. read more