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Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. read more
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. read more