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Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
.. read more
Gravure Printing of ITO Transparent Electrodes for Applications in Printed Electronics
ITO nanoparticles were successfully printed on glass with the AccuPress Gravure System
•A wide range of sheet resistivity values was achieved with different engraving resolutions of the gravure
.. read more
Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more
Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper.
.. read more
Gravure Printing of ITO Transparent Electrodes for Applications in Printed Electronics
ITO nanoparticles were successfully printed on glass with the AccuPress Gravure System
•A wide range of sheet resistivity values was achieved with different engraving resolutions of the gravure
.. read more