Knowledge Hub
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Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
PTH Core-to-Core Interconnect Using Sintered Conductive Pastes
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and
focused on specialized applications in the military and high end comp
.. read more
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour
High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Reliability of Mis-registered HDI Plated Through Holes
Mechanically drilled through holes in PWBs form interconnects between copper layers through the use of copper pads. These pads are larger than the drill diameter to account for such factors as
.. read more
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
PTH Core-to-Core Interconnect Using Sintered Conductive Pastes
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and
focused on specialized applications in the military and high end comp
.. read more
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour
High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Reliability of Mis-registered HDI Plated Through Holes
Mechanically drilled through holes in PWBs form interconnects between copper layers through the use of copper pads. These pads are larger than the drill diameter to account for such factors as
.. read more