Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes

Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as .. read more

Lead-Free Solder Bumping Technologies

Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as viable drop-in replacements to tin-lead solder. High melting point tin alloys such .. read more

Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes

Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as .. read more

Lead-Free Solder Bumping Technologies

Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as viable drop-in replacements to tin-lead solder. High melting point tin alloys such .. read more