Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis

Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of .. read more

Rework of New High Speed Press Fit Connectors

More and more people and things are using electronic devices to communicate. Subsequently,many electronic products,in particular mobile base stations and core network nodes,need to handle enorm .. read more

Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies

Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on .. read more

Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis

Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of .. read more

Rework of New High Speed Press Fit Connectors

More and more people and things are using electronic devices to communicate. Subsequently,many electronic products,in particular mobile base stations and core network nodes,need to handle enorm .. read more

Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies

Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on .. read more