Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Smart Molded Structures Bring Surfaces to Life

This paper introduces structural electronics technology enabling smart molded structures. It also presents a case for developing industry standards specific to structural electronics materia .. read more

Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems

Indiana Integrated Circuits has developed "Quilted" modular PCBs.  They consist of multiple small "boardlets" with traces or pads on rough edges of the boards.  These rough edges f .. read more

Thermal Cycle Testing of PWBs – Methodology

Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This artic .. read more

Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...

The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S .. read more

NEMI Update on Optoelectronics Initiatives

National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key issues identified by the industry. These cover the areas of Fiber Management,Sig .. read more

CAF Resistant,Reinforced Microvia Dielectrics

This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ .. read more

Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach

Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for a particular product. Many programs simply default to a standard test without .. read more

Smart Molded Structures Bring Surfaces to Life

This paper introduces structural electronics technology enabling smart molded structures. It also presents a case for developing industry standards specific to structural electronics materia .. read more

Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems

Indiana Integrated Circuits has developed "Quilted" modular PCBs.  They consist of multiple small "boardlets" with traces or pads on rough edges of the boards.  These rough edges f .. read more

Thermal Cycle Testing of PWBs – Methodology

Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This artic .. read more

Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...

The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S .. read more

NEMI Update on Optoelectronics Initiatives

National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key issues identified by the industry. These cover the areas of Fiber Management,Sig .. read more

CAF Resistant,Reinforced Microvia Dielectrics

This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ .. read more

Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach

Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for a particular product. Many programs simply default to a standard test without .. read more