Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. read more
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. read more