Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. read more