Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. read more
Recrystallization Principles Applied to Whisker Growth in Tin
Tin whiskers found in electroplated deposits are known to be single crystals which spontaneously grow. Thus
whisker growth can be regarded as a grain growth phenomenon. In this paper we examine
.. read more
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. read more
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. read more
Recrystallization Principles Applied to Whisker Growth in Tin
Tin whiskers found in electroplated deposits are known to be single crystals which spontaneously grow. Thus
whisker growth can be regarded as a grain growth phenomenon. In this paper we examine
.. read more
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. read more