Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Oxidation and Topography of Powder in Pb-free Solder Paste

There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these include the following: ?? Customer requirements to reflow SAC-based (SnAgCu) .. read more

Avoiding the Solder Void

Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for so .. read more

Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes

Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics when fresh but then suffer rapid degradation. Although rosin based pastes .. read more

Oxidation and Topography of Powder in Pb-free Solder Paste

There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these include the following: ?? Customer requirements to reflow SAC-based (SnAgCu) .. read more

Avoiding the Solder Void

Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for so .. read more

Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes

Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics when fresh but then suffer rapid degradation. Although rosin based pastes .. read more