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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Controlling Voiding Mechanisms in the Reflow Soldering Process

While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. For .. read more

Void or Not to Void

- Background: What is a void? - What is a "macro" void? - What is a “planar” void? - What is a “shrinkage” void? - What is a “microvia” void? - What is a “pinhole” void? - What is a “Kirkendall .. read more

Controlling Voiding Mechanisms in the Reflow Soldering Process

While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. For .. read more

Void or Not to Void

- Background: What is a void? - What is a "macro" void? - What is a “planar” void? - What is a “shrinkage” void? - What is a “microvia” void? - What is a “pinhole” void? - What is a “Kirkendall .. read more