Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)

The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu .. read more

Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications

The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig .. read more

Determination of Copper Foil Surface Roughness from Micro-section Photographs

Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an .. read more

High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)

The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu .. read more

Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications

The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. To effectively navig .. read more

Determination of Copper Foil Surface Roughness from Micro-section Photographs

Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an .. read more