Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th
.. read more
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. read more
Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th
.. read more
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. read more