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Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
.. read more
Innovations using Ethyl Nonafluorobutyl Ether Provide Superior Solvent Properties for Defluxing No-Clean and Microelectronic Assemblies
The evaluation of a new solvent blend to clean printed wire boards is reported. Ethyl nonafluorobutyl ether (HFE-
7200) provides the fluid dynamics to build engineered cleaning fluids that exhi
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
.. read more
Innovations using Ethyl Nonafluorobutyl Ether Provide Superior Solvent Properties for Defluxing No-Clean and Microelectronic Assemblies
The evaluation of a new solvent blend to clean printed wire boards is reported. Ethyl nonafluorobutyl ether (HFE-
7200) provides the fluid dynamics to build engineered cleaning fluids that exhi
.. read more