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Reliability and Failure Analysis of Lead-Free Solder Joints
This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute
.. read more
Reliability and Failure Analysis of Lead-Free Solder Joints
This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute
.. read more