Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. read more
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. read more
Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization – Immersion Study
“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au
.. read more
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
.. read more
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
The Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability
With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam
.. read more
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way
.. read more
VOC-free Flux Study Not All WOA (Weak Organic Acids) Are the Same
In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers
have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC
.. read more
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. read more
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. read more
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. read more
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. read more
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. read more
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
The Digital Solder Paste
Since the beginning of Surface Mount Technology over 40 years ago solder paste has been an integral element in electronics assembly. Historically solder paste design and development has been,in
.. read more
A New Approach to Conformal Coating Demonstrates Significantly Improved Ruggedization Performance
IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ [1] outlines an IPC study of major conformal coating types, coating application
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
Risk Prediction of Electrochemical Migration on Electronic Control Units - A Practical Approach
Reliability testing applying surface insulation resistance (SIR) measurements to materials that are used for electronic devices is a fundamental task in the automotive industry. SIR measurem
.. read more
Investigation of the Electrochemical Reliability of Conformal Coatings Under High Voltage
The surface insulation resistance (SIR) of conformal coatings was investigated using increased stress by high voltage bias up to 1000V. Test boards had been prepared according to IPC-9202, u
.. read more
Expandable Bio-based Polymers: A Lightweight Future for Electronics Ruggedization – Immersion Study
“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au
.. read more
IPC-J-STD-001 Rev G, Amendment 1, Section 8 Cleanliness SectionSIR Test Method for Developing Objective Evidence for the Production Assembly
Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d
.. read more
Do Bubbles in Conformal Coatings Reduce the Electrochemical Reliability? An SIR Study of Coated QFN
A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal co
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
The Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability
With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam
.. read more
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way
.. read more
VOC-free Flux Study Not All WOA (Weak Organic Acids) Are the Same
In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers
have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC
.. read more
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. read more
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. read more
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. read more
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. read more
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
Vapor phase and Convection Reflow: Comparison of Solder Paste Residue Chemical Reliability
Convection soldering remains the most common reflow process in electronic assembly,mostly in air,but sometimes using a nitrogen atmosphere to reduce oxidation.
On the other hand,vapor phase sol
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Understanding Cleanliness and Methods of Determination
Several methods exist to determine cleanliness of printed wiring assemblies. This presentation will describe the common methods used for determining cleanliness of printed wiring assemblies. Th
.. read more
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
The Digital Solder Paste
Since the beginning of Surface Mount Technology over 40 years ago solder paste has been an integral element in electronics assembly. Historically solder paste design and development has been,in
.. read more