Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

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Realization of a New Concept for Power Chip Embedding

Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top .. read more

Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card

A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w .. read more

Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C

A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra .. read more

The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity,High Density Packaging User Group (HDP) Project

The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ .. read more

Options for Assembly using High Temperature Interconnection Technologies

There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics .. read more

IPC-CC-830B Versus the 'Real World': Part 2

Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal .. read more

Realization of a New Concept for Power Chip Embedding

Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top .. read more

Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card

A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w .. read more

Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C

A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra .. read more

The Impact of New Generation Chemical Treatment Systems on High Frequency Signal Integrity,High Density Packaging User Group (HDP) Project

The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ .. read more

Options for Assembly using High Temperature Interconnection Technologies

There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics .. read more

IPC-CC-830B Versus the 'Real World': Part 2

Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal .. read more