Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Reliability of Soler Joints: Will Void Free Vacuum Soldering Help?

Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturer .. read more

Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi

This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo .. read more

Simulation of Embedded Components in PCB Environment and Verification of Board Reliability

Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top .. read more

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st .. read more

Reliability of Soler Joints: Will Void Free Vacuum Soldering Help?

Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturer .. read more

Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi

This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo .. read more

Simulation of Embedded Components in PCB Environment and Verification of Board Reliability

Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top .. read more

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st .. read more