Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
.. read more
Improving Oxide Resistance and Solderability of Electroplated Tin & Tin Alloy Coatings for Component Plating and Printed Circuit Board Final...
Abstract
Electroplated tin and tin alloy coatings are used in electronics plating applications as a solderable and corrosion resistant
surface finish for components and printed circuit boards (
.. read more
Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
.. read more
Improving Oxide Resistance and Solderability of Electroplated Tin & Tin Alloy Coatings for Component Plating and Printed Circuit Board Final...
Abstract
Electroplated tin and tin alloy coatings are used in electronics plating applications as a solderable and corrosion resistant
surface finish for components and printed circuit boards (
.. read more