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Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe
.. read more
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. read more
Effects of Tin Whisker Formation on Nanocrystalline Copper
Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO
.. read more
Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe
.. read more
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. read more
Effects of Tin Whisker Formation on Nanocrystalline Copper
Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO
.. read more