Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations

As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes. .. read more

Influence of Process Parameters on Inkjet Printing of Silver Conductive Traces for Digital Additive Manufacturing of Flexible Electronics

The results of a NextFlex project addressing barriers that are preventing inkjet printing from being adopted for prototyping and volume manufacturing of printed circuits, are presented. Thes .. read more

Why Signal Always Be Loss in a High Speed Frequency Transmission Line

The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate .. read more

PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems

For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si .. read more

Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”

The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim .. read more

Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing

Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean .. read more

3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections

When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact signal integrity at high data rates including: inconsistencies in dielectri .. read more

Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations

As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes. .. read more

Influence of Process Parameters on Inkjet Printing of Silver Conductive Traces for Digital Additive Manufacturing of Flexible Electronics

The results of a NextFlex project addressing barriers that are preventing inkjet printing from being adopted for prototyping and volume manufacturing of printed circuits, are presented. Thes .. read more

Why Signal Always Be Loss in a High Speed Frequency Transmission Line

The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate .. read more

PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems

For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si .. read more

Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”

The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim .. read more

Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing

Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean .. read more

3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections

When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact signal integrity at high data rates including: inconsistencies in dielectri .. read more