Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for
applications ranging from smart cards to space-based radars. For hig
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more
Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for
applications ranging from smart cards to space-based radars. For hig
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more