Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
Evaluation of Underfill Material on Board Level Reliability Improvement of Wafer Level CSP Component
In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end
networking and telecommunication products. Due to their small footprint a
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
Evaluation of Underfill Material on Board Level Reliability Improvement of Wafer Level CSP Component
In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end
networking and telecommunication products. Due to their small footprint a
.. read more