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A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor
Prediction of accurate values for insertion loss (S21) on printed circuit boards has become ever more critical to SI modeling as signal speeds required for next-generation networking equipment
.. read more
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor
Prediction of accurate values for insertion loss (S21) on printed circuit boards has become ever more critical to SI modeling as signal speeds required for next-generation networking equipment
.. read more