Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. read more
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. read more
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. read more
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. read more