Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Understanding Electroless Nickel Thickness in ENIG and ENEPIG
IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th
.. read more
Non‐Destructive Measurement Improvements in Determining the Phosphorus Content in Electroless Nickel Deposits for ENIG And ENEPIG Using XRF
Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. Improveme
.. read more
Direct Determination of Phosphorus Content in Electroless Nickel Plating Using X-ray Fluorescence (XRF) Spectroscopy
Electroless plating processes are popular because of their performance,reliability and cost effectiveness. The process combines unique deposit properties such as uniform plating build up regard
.. read more
Is the ENIG Process Evil,or is it Maybe QA,Engineer or Sales Guy?
The case of processing issues with Electroless Nickel/Immersion Gold (ENIG) is well documented,even as it endures as a very popular surface finish. Certainly the market says that quality ENIG h
.. read more
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. read more
Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. read more
Screening for Counterfeit Electronic Parts
Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or
.. read more
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
High reliability applications in the military and aerospace industry require reliable solder finish
identification on components within the supply system of DoD,NASA,and many other organization
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Understanding of XRF Technology and Clarification of its Application for RoHS
RoHS directives require screening and quantification of certain elements and compounds used in electronics components and parts.
X-ray Fluorescence (XRF) technology has emerged as an effective
.. read more
What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL
Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl
.. read more
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. read more
Understanding Electroless Nickel Thickness in ENIG and ENEPIG
IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th
.. read more
Non‐Destructive Measurement Improvements in Determining the Phosphorus Content in Electroless Nickel Deposits for ENIG And ENEPIG Using XRF
Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. Improveme
.. read more
Direct Determination of Phosphorus Content in Electroless Nickel Plating Using X-ray Fluorescence (XRF) Spectroscopy
Electroless plating processes are popular because of their performance,reliability and cost effectiveness. The process combines unique deposit properties such as uniform plating build up regard
.. read more
Is the ENIG Process Evil,or is it Maybe QA,Engineer or Sales Guy?
The case of processing issues with Electroless Nickel/Immersion Gold (ENIG) is well documented,even as it endures as a very popular surface finish. Certainly the market says that quality ENIG h
.. read more
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. read more
Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. read more
Screening for Counterfeit Electronic Parts
Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or
.. read more
Reliable Solder Identification by X-ray Fluorescence Spectroscopy
High reliability applications in the military and aerospace industry require reliable solder finish
identification on components within the supply system of DoD,NASA,and many other organization
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Understanding of XRF Technology and Clarification of its Application for RoHS
RoHS directives require screening and quantification of certain elements and compounds used in electronics components and parts.
X-ray Fluorescence (XRF) technology has emerged as an effective
.. read more
What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL
Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl
.. read more
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. read more