Global Electronics Association's ADEPT Council Deepens Taiwan Presence as First Satellite Council Holds Inaugural In-Person Meeting

Convening more than 10 companies in Taiwan to shape global technology roadmaps, with a focus on next-generation guidelines and standards critical to AI and HPC

The Global Electronics Association's Advanced Electronic Packaging Technology (ADEPT) Leadership Council is deepening its presence in Taiwan. ADEPT Taiwan, the Council's first satellite council worldwide, today held its inaugural in-person meeting at Taipei Nangang Exhibition Center, focusing on advanced packaging tasks related to artificial intelligence (AI) and high-performance computing (HPC).

Established in April 2025 under the Association's Advanced Electronic Packaging program, the ADEPT Council has brought together more than 25 companies spanning original equipment manufacturers (OEMs), integrated device manufacturers (IDMs), electronic design automation (EDA), outsourced semiconductor assembly and test (OSAT), printed circuit boards (PCBs) and electronics manufacturing services (EMS). Members include IBM, Meta, AMD, Google, Intel, HP, ASE, Texas Instruments, NXP, Renesas, Siemens EDA  and so on. ADEPT serves as an industry networking platform to discuss technology roadmap gaps, challenges and potential solutions from component-level to system-level packaging, focusing on three areas: high-performance computing, automotive and industrial, and aerospace and defense. Its technology scope covers chiplets, packaging, substrates, PCBs and system assembly and reliability. The Council meets monthly, and its task groups develop technology roadmap content on specific topics.

Since its founding, ADEPT has led the expansion of chapters in the Heterogeneous Integration Roadmap (HIR), including Chapter 22 (2D/3D interconnects and assembly) and Chapter 24 (reliability), which covers HPC package-to-board and wafer-level packaging (WLP)-to-board reliability. On new standards domain, ADEPT launched and initiative for the development standards for panel level packaging in April 2026, with 13 participating companies, and began work on another initiative on advanced substrate standards in June. ADEPT has also co-hosted or led conferences, workshops and special sessions in the United States, Germany, Malaysia and Taiwan.

ADEPT Taiwan is focused on AI and HPC applications. Its planned task areas include component-to-board integration challenges, as well as high-layer-count (HLC) and high-density interconnect (HDI) PCBs for AI and HPC applications and Substrate-like PCB, or SLP technology. 

"ADEPT allows us to connect the global advanced electronic packaging supply chain, from high-performance computing to automotive and industrial applications, where technology roadmaps and standards depend on broad industry participation," said Matt Kelly, CTO and vice president of technology solutions at the Global Electronics Association. "Taiwan has a complete supply chain spanning substrates, PCBs, packaging and test, and system assembly. Establishing ADEPT's first satellite council here reflects the Association's long-term commitment to Taiwan. We look forward to working with our Taiwan partners to bring the practical experience of Taiwan's industry into next-generation guidelines and standards worldwide," said Devan Iyer PhD., Chief Strategist of Advanced Electronic Packaging at the Global Electronics Association.

More than 10 Taiwan member companies took part in the inaugural in-person meeting. ADEPT Taiwan will continue to set its task priorities based on feedback from Taiwan member companies and will keep working with partners in Taiwan.