The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.

IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025. The technical conference will be held March 18-20 and professional development courses will take place March 16-17 and 20, 2025 at the Anaheim Convention Center in Anaheim, Calif.

This year, the cable and wire harness manufacturing industry came to “harness the future” at the Electrical Wire Processing Technology Expo (EWPTE), held May 14-16 at Baird Center in Milwaukee, Wis., and left inspired with access to new technologies, and solutions to challenging issues through training and education and a network of leading-edge companies, industry leaders and subject matter experts. Produced by the Wiring Harness Manufacturer’s Association (WHMA), IPC and Baird Center, the event drew in a total of 2,939 attendees.

WHMA/IPC announces that 215 exhibitors spanning over 50,000 nsf of exhibit space will introduce new product technologies, innovations and demonstrations of the electrical wire harness, wire, coil winding and cable processing industries’ newest advancements at Electrical Wire Processing Technology Expo (EWPTE) to be held at Baird Center May 14-16, 2024, in Milwaukee, Wis.

At IPC APEX EXPO 2024 in Anaheim, Calif., five competitors squared off to determine who was the best of the best at PCB design.