Starting September 12, IPC’s Road to Reliability Webinar series will bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. Speakers will examine reliability drivers, technology applications, and target lifecycles in each free webinar.

Ensuring reliability in high-voltage electronics, a new standardized test method for abrasion resistance of e-textiles, and assembly and solder joint X-ray challenges are just a few of technical conference topics offered at IPC’s High Reliability Forum October 9-10 at the McKimmon Center in Raleigh, N.C.

In conjunction with Electronics Manufacturing Expo Asia (EMAX) 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Penang, Malaysia July 24-26, 2024. The competition welcomed 36 contestants from 14 well-known electronics companies, and one institution in Malaysia.

From July 8-10, the 2024 IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition, was the largest in the history of the Greater China region, bringing nearly 400 electronics industry elites from 18 provinces and municipalities. The event covered diverse industry sectors, including aerospace, automotive electronics, rail transit, consumer electronics, energy, and industrial manufacturing.

The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.

IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025. The technical conference will be held March 18-20 and professional development courses will take place March 16-17 and 20, 2025 at the Anaheim Convention Center in Anaheim, Calif.