IPC Applauds New U.S. Government Strategy for Advanced Packaging
Washington, DC, November 20, 2023 – The U.S. Government’s announcement today of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.
U.S. Economy Approaches Tipping Point, Evidence Indicates Downturn in Europe
IPC releases October 2023 Economic Outlook Report
New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem
Today, IPC, in collaboration with other industry organizations and representatives from academia and government celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap.
IPC President and CEO Dr. John W. Mitchell Releases New Book, “Fire Your Hiring Habits”
Fire Your Hiring Habits: Building an Environment that Attracts Top Talent in Today's Workforce, by IPC President and CEO Dr. John W. Mitchell has been published by Forbes Books and is now available. Proceeds from the book will go to the IPC Education Foundation (IPCEF) to support careers in the electronics manufacturing industry.
Spring Issue of IPC Community Now Available for Download
The Spring issue of IPC Community is now available for download. This quarterly publication was created with IPC members and industry in mind! In this issue, readers will find articles, interviews, columns, graphics, surveys, IPC member benefits, and so much more.
Global Banking Crisis Signals Economic Volatility, Signs of Recession
IPC Issues March Economic Outlook Report