Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
European EMS Market Grew to a Record Level in 2023 But May Experience Challenges in 2024
As revealed this week by an annual survey conducted by in4ma and sponsored by IPC Electronics Europe GmbH, the European electronics manufacturing services (EMS) industry experienced a robust 11 percent growth last year.
IPC White Paper Emphasizes the Critical Importance of Data Analytics for the Electronics Manufacturing Process
The increasing complexity of electronics manufacturing requires embracing data analytics to manage electronics factories, according to a new white paper from IPC’s Chief Technologist Council (CTC), Outlook for Data Analytics in the Electronics Manufacturing Industry.
IPC Applauds New U.S. Government Strategy for Advanced Packaging
Washington, DC, November 20, 2023 – The U.S. Government’s announcement today of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.
U.S. Economy Approaches Tipping Point, Evidence Indicates Downturn in Europe
IPC releases October 2023 Economic Outlook Report
New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem
Today, IPC, in collaboration with other industry organizations and representatives from academia and government celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap.