EMS Industry Sees Year-end Bookings Surge, Signaling Stronger Demand Ahead

The Global Electronics Association releases EMS industry results for December 2025

The Global Electronics Association announced today the December 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.24.

North American PCB Industry Ends 2025 with Strong Book-to-Bill and Double-Digit Shipment Growth

The Global Electronics Association releases PCB industry results for December 2025

The Global Electronics Association announced today the December 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.18.

Unlock Breakthrough Electronics Innovation at the APEX EXPO 2026 Technical Conference

Electronics engineers, technologists, and industry leaders have a strategic advantage at this year’s Advanced Electronic Packaging Conference, the premier technical conference at APEX EXPO 2026.

India’s Electronics Manufacturing Ecosystem Gears Up for IEMI 2026

Join the Forum January 29–30 in Bengaluru Connecting Industry and Government and Advancing Electronics Manufacturing in South Asia

India continues its acceleration as a global electronics manufacturing hub. At the heart of this momentum is Integrated Electronics Manufacturing & Interconnections (IEMI) 2026, the flagship industry platform of the Global Electronics Association.

Global Electronics Association Appoints Raj Tiwari as County Manager to Advance Thailand's Electronics Manufacturing Ecosystem

To further reinforce its engagement in Thailand, the Global Electronics Association has appointed Raj Tiwari as Country Manager – Thailand.

New IPC-6921 Standard Sets Requirements and Acceptance Criteria for Organic IC Substrates

Global community of 246 technical specialists develops unified specifications for advanced packaging; core technical requirements to be addressed in Feb. 5 webinar

The Global Electronics Association has officially released IPC-6921, Requirements and Acceptance for Organic IC Substrates.