Global Electronics Association East Asia Awards Recognize Industry Leadership and Talent Development
Global Electronics Association East Asia recognizes the individuals and organizations making meaningful contributions to the electronics industry through its East Asia Awards. The awards honor committee leaders and members who help advance industry collaboration, as well as companies, educational institutions, and individuals committed to developing the skilled workforce needed to support the industry’s continued growth.
North American PCB Orders Surge as September Shipments Fall 6.4% Year Over Year
The Global Electronics Association announced today the September 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.77.
Silicon Carbide and Gallium Nitride Play Growing Role in Electronics Design, Manufacturing and Supply-Chain Strategy
Silicon carbide (SiC) and gallium nitride (GaN) power devices are expanding their role in electronics, with implications extending beyond component selection to product design, manufacturing capability and supply-chain planning, according to new research from the Global Electronics Association and Accuris.
Global Electronics Association's ADEPT Council Deepens Taiwan Presence as First Satellite Council Holds Inaugural In-Person Meeting
The Global Electronics Association's Advanced Electronic Packaging Technology (ADEPT) Leadership Council is deepening its presence in Taiwan.
Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with Technical Perspectives from Unimicron, STATS ChipPAC and Wistron
The Global Electronics Association today hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and market research firm TechSearch International.
High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method
High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.