IPC’s Annual High Reliability Forum Adds Microvia Summit to Conference Lineup
IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.
IPC Releases Report Projecting Employment Growth in European Electronics Sector; Launches Ambitious New Workforce Initiative
Employment in the European electronics sector is expected to grow according to a new study by Oxford Economics released today by IPC—Association Connecting Electronics Industries®. Such a trend would exacerbate issues created by an existing shortage of skilled workers according to our members.
IPC Offers Tech Ed Course on Utilizing J-STD-001 and IPC-A-610 Together
IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together. IPC offers a new technical education course, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, to provide instruction on how best to use these documents jointly.
IPC to Host Workshops on U.S. Export Controls
U.S. export control rules have changed significantly in the last decade, and more change is expected over the next few years as policymakers tackle the treatment of emerging and foundational technologies and respond to geopolitical developments.
IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2019
In conjunction with Global Industrie/Midest and SNESE, IFTEC and IPC conducted the first regional European qualification for the IPC Hand Soldering Competition in Lyon, France on March 5-8, 2019. The competition was fierce as 32 competitors went soldering iron to soldering iron to compete for the coveted hand soldering competition crown.
IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance.