The Global Electronics Association today announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote address at APEX EXPO 2027 on Tuesday, April 6, focused on the forces reshaping the global electronics industry.

The Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing.

Europe is one of the world’s three largest markets for AI data centres. However, most of the value created by that demand accrues to companies and supply chains outside of the EU. Today, the Global Electronics Association released From Chips to Systems: Building an End-to-End EU Strategy for Data Centre, Cloud Infrastructure and AI, a joint report with DECISION Études & Conseil that quantifies that gap, layer by layer, and offers a practical policy roadmap to close it.

The Global Electronics Association today announced the relaunch of its Double Materiality Assessment (DMA) Toolkit for the Electronics Industry, an updated resource designed to help organizations navigate double materiality assessment planning amid changing sustainability and corporate reporting expectations.

The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry.

Radbon Electronics Co., Ltd. has passed the IPC/WHMA-A-620 Qualified Manufacturers List (QML) validation by the Global Electronics Association, earning its place on the IPC Global Qualified Manufacturers List.