IPC and International Electronics Manufacturing Initiative (iNEMI), have signed a Memorandum of Understanding (MoU) to collaborate and share information on developing technology roadmaps, organizing forums, establishing new programs, and identifying additional industry needs and projects for the mutual benefit of the membership of both organizations.

IPC announced today the June 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.12.

The following statement is attributed to John Mitchell, IPC president and CEO, regarding June’s unemployment report from the U.S. Department of Labor. Based on the data, IPC estimates the electronics manufacturing industry gained 20,000 jobs.

For the first time, the IPC Board of Directors will include an IPC student member with a full voting board seat, in response to increased student member involvement in IPC and the potential for student members, as the emerging workforce, to influence workforce development. Paige Fiet, president of the IPC Student Chapter at Michigan Technological University, was elected as the first IPC Board of Directors Student Member Liaison. The IPC Education Foundation (IPCEF) developed the nomination/election process with IPC Student Chapter advisors and every IPC Student Chapter member was eligible to vote.

IPC has partnered with German-based in4ma to better support standards, education and advocacy needs for the growing EMS industry in Europe. Formed by Dieter G. Weiss in 2015, in4ma has been a leading market research and industry analysis consulting company supporting the 45 billion Euro EMS industry.

IPC announced today the May 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.10.

IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain of manufacturing products that utilize high-density electronic packages and printed circuit boards, have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Registration is now open for IPC E-Textiles 2020 Virtual Summit, to be held Thursday, October 1 and Friday, October 2. IPC E-Textiles 2020 Virtual Summit will consist of two 90-minute interactive educational workshops each day, as well as a live tour of the University of Minnesota Wearable Technology Lab.

With electronic systems expected to reach 50 percent of the total car cost by 2030, electronics companies are of critical importance in the automotive supply chain as a driver of quality and supporting OEM development goals.

Obtaining data from the supply chain to support chemical (“substance”) content reporting for article (hardware) products remains extremely challenging and resource-intensive for industries such as Aerospace and Defense (AD). However, the increasing use of materials and substances declaration standards promotes efficiency in obtaining such data. IPC and IAEG® (International Aerospace Environmental Group) encourage the use of IPC-1754, Materials and Substances Declaration for Aerospace and Defense and Other Industries in the AD industry and its global supply cha