IPC standards deliver on consistency, high-reliability and quality for products manufactured in the electronics industry

IPC document revision table.

IPC standards deliver on consistency, high-reliability, and quality for the electronics industry from consensus requirements for design, manufacture and acceptance of printed boards, assemblies, and cables.

The IPC-175x family of standards establishes a standard reporting format for data exchange between supply chain participants. This series of standards is XML-schema based, which allows for more efficient and effective communication of data. Each standard in the series is explained below.

Obtaining data from the supply chain to support chemical (“substance”) content reporting for article (hardware) products remains extremely challenging and resource-intensive for industries such as Aerospace and Defense (AD). However, the increasing use of materials and substances declaration standards promotes efficiency in obtaining such data. IPC and IAEG® (International Aerospace Environmental Group) encourage the use of IPC-1754, Materials and Substances Declaration for Aerospace and Defense and Other Industries in the AD industry and its global supply cha

IPC announces the release of a new standard, IPC-9797, Press-fit Standard for Automotive Requirements and Other High-Reliability Applications. The comprehensive document covers the qualifications and acceptance requirements for press fit technology, including the high-reliability needs for automotive and other industries such as aerospace.

IPC announces the release of IPC J-STD-001GA/IPC-A-610GA, Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies. The addendum is a first-of-a-kind document that requires the use of both J-STD-001 and IPC-A-610 along with requirements in the addendum, as it looks at the whole of the electronics assembly manufacturing process from assembly to inspection addressing board reliability requirements for the automotive industry.

IPC announces the release of five newly revised standards covering several areas of the supply chain, IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards.

Because IPC APEX EXPO will be held in January for the next five years, IPC will move its standards development committee meetings normally scheduled in Fall to June in 2019. This decision follows a survey of the standards committees where respondents indicated they would prefer to hold in-person standards development meetings in the summer months to have ample time to work on documents. IPC previously hosted its Fall Committee Standards Development meetings in conjunction with SMTA International (SMTAI).

Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC's top standards development oversight committee for the past two years.