In this month’s economic outlook report from IPC, you will find U.S. and European data on economic growth, employment, consumer sentiment, manufacturers’ sentiment (PMI), manufacturing capacity utilization and end markets for electronics.
IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.
To provide a market solution to address a need for a fundamentals training course on PCBA processes and electronics manufacturing, IPC is announcing the launch of “Electronics Assembly for Engineers” (EAE) as its newest workforce development training course.
IPC today issued the following statement from President and CEO, John Mitchell, on the bipartisan infrastructure bill approaching a vote this week in the U.S. Senate.
IPC launched a global survey of printed circuit board (PCB) manufacturers in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for PCB fabricator survey responses is July 13.
IPC issued the following statement from President and CEO John Mitchell on today’s expected passage of the bipartisan infrastructure bill in the U.S. Senate.
IPC reports that 85 percent of exhibit floor space has been sold for IPC APEX EXPO® 2019. Three hundred twenty-seven exhibitors have been assigned to 134,200 net square feet of exhibit space, marking a 5 percent increase in square footage compared to 2018’s booth space selection event. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 29–31, 2019, at the San Diego Convention Center in San Diego, Calif.
The first stop on IPC’s E-Textiles 2021 Virtual World Tour will be the bustling electronics manufacturing hub of Taipei City, Taiwan on September 2, 2021.
IPC – Association Connecting Electronics Industries, the global industry association representing the $2 trillion global electronics industry, applauds a U.S. Senate committee for its work in advancing a workforce education and training bill.
High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.